 |
| Wingi: | |
|---|---|
Maelezo
Chapa: Yint
Min. Agizo: kipande 1
Ufungaji: Katika reel
Uthibitisho: ROHS
Maombi: MIPI, interface ya serial ya MHL kwenye kifaa cha rununu.
Maelezo ya bidhaa
| Sehemu Na. | Imp. Com. (Ω) ± 25% @100MHz | DCR max. (Ω) | Iliyokadiriwa Max ya sasa. (MA) | Voltage iliyokadiriwa (V) | Kuhimili voltage (v) | Upinzani wa Insulation Min. (MΩ) |
| YC2M2012B670GBE | 67 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B900GBE | 90 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B121GBE | 120 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B161GBE | 160 | 0.50 | 400 | 10 | 25 | 200 |
| YC2M2012B181GBE | 180 | 0.50 | 400 | 10 | 25 | 200 |
| YC2M2012B221FBE | 220 | 0.50 | 300 | 10 | 25 | 200 |
| Vyombo vya mtihani | Agilent E4991A RF Impedance / nyenzo AnalyzerHP4338 Milliohmmeter Agilent E5071c ENA Series Mtandao Mchanganuzi Keithley 2410 1100V Chanzo cha mita mita | |||||
Nambari ya nambari ya sehemu
| Yc2m | 2012 | B | 900 | □ | B | E |
| 1 | 2 | 3 | 4 | 5 | 6 | 7 |
1. Jina la mfululizo
2. Vipimo l*w
3. Nambari ya nyenzo
4. Impedance (Ex: 900 = 90Ω)
5. Iliyokadiriwa nambari ya sasa
50mA/b 80mA/c 100mA/d 150mA/e 200mA/f 300mA/g 400mA/h 500mA/j 700mA/k 800mA
6. Kuuzwa: Sehemu za Kijani: A-SOLDERING LEAD-BURE/B-LEAD-FREE KWA CHIP nzima
Mtindo wa 7.Packaing: mkanda wa E-embossed, 7 'reel
Maumbo na vipimo
| Aina | Mwelekeo |
| L | 2.00 ± 0.20 |
| W | 1.25 ± 0.20 |
| T | 1.00 ± 0.10 |
| P | 1.60 ± 0.20 |
| C1 | 0.40 ± 0.20 |
| C2 | 0.30 ± 0.20 |
| Kitengo: mm | |
Vitambulisho vya Moto: YC2M 2012B Series EMC/EMI Vichungi, Uchina, Watengenezaji, Kiwanda, Bei, Njia za kawaida za choko, Njia ya kawaida ya SMD, Vichungi vya EMC EMI, Njia ya kawaida ya choke, Vichungi vya hali ya kawaida ya Chip, Vichungi vya hali ya kawaida
Maelezo
Chapa: Yint
Min. Agizo: kipande 1
Ufungaji: Katika reel
Uthibitisho: ROHS
Maombi: MIPI, interface ya serial ya MHL kwenye kifaa cha rununu.
Maelezo ya bidhaa
| Sehemu Na. | Imp. Com. (Ω) ± 25% @100MHz | DCR max. (Ω) | Iliyokadiriwa Max ya sasa. (MA) | Voltage iliyokadiriwa (V) | Kuhimili voltage (v) | Upinzani wa Insulation Min. (MΩ) |
| YC2M2012B670GBE | 67 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B900GBE | 90 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B121GBE | 120 | 0.40 | 400 | 10 | 25 | 200 |
| YC2M2012B161GBE | 160 | 0.50 | 400 | 10 | 25 | 200 |
| YC2M2012B181GBE | 180 | 0.50 | 400 | 10 | 25 | 200 |
| YC2M2012B221FBE | 220 | 0.50 | 300 | 10 | 25 | 200 |
| Vyombo vya mtihani | Agilent E4991A RF Impedance / nyenzo AnalyzerHP4338 Milliohmmeter Agilent E5071c ENA Series Mtandao Mchanganuzi Keithley 2410 1100V Chanzo cha mita mita | |||||
Nambari ya nambari ya sehemu
| Yc2m | 2012 | B | 900 | □ | B | E |
| 1 | 2 | 3 | 4 | 5 | 6 | 7 |
1. Jina la mfululizo
2. Vipimo l*w
3. Nambari ya nyenzo
4. Impedance (Ex: 900 = 90Ω)
5. Iliyokadiriwa nambari ya sasa
50mA/b 80mA/c 100mA/d 150mA/e 200mA/f 300mA/g 400mA/h 500mA/j 700mA/k 800mA
6. Kuuzwa: Sehemu za Kijani: A-SOLDERING LEAD-BURE/B-LEAD-FREE KWA CHIP nzima
Mtindo wa 7.Packaing: mkanda wa E-embossed, 7 'reel
Maumbo na vipimo
| Aina | Mwelekeo |
| L | 2.00 ± 0.20 |
| W | 1.25 ± 0.20 |
| T | 1.00 ± 0.10 |
| P | 1.60 ± 0.20 |
| C1 | 0.40 ± 0.20 |
| C2 | 0.30 ± 0.20 |
| Kitengo: mm | |
Vitambulisho vya Moto: YC2M 2012B Series EMC/EMI Vichungi, Uchina, Watengenezaji, Kiwanda, Bei, Njia za kawaida za choko, Njia ya kawaida ya SMD, Vichungi vya EMC EMI, Njia ya kawaida ya choke, Vichungi vya hali ya kawaida ya Chip, Vichungi vya hali ya kawaida
