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- Small package: The SOP-8L package adopts a small size and is suitable for integrating multiple devices in a limited space.
- Surface mounting technology: The SOP-8L package adopts surface mounting technology, which facilitates automated production and welding and improves production efficiency.
- Low Resistance: The MOSFET SOP-8L package features low resistance, providing efficient electrical performance.
- Low power consumption: SOP-8L packaged MOSFET devices usually have low power consumption characteristics and are suitable for applications requiring energy saving.
- Good heat dissipation performance: SOP-8L packages are usually designed with a good heat dissipation structure, which can effectively dissipate the heat generated by the device and improve the reliability and stability of the device.
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| Symbol | Dimensions in Millimeters | ||
| MIN. | NOM. | MAX. | |
A | -- | -- | 1.75 |
| A1 | 0.10 | -- | 0.23 |
| b | 0.35 | -- | 0.48 |
| c | 0.19 | -- | 0.25 |
| D | 4.70 | 4.90 | 5.10 |
| E | 5.80 | 6.00 | 6.20 |
| E1 | 3.70 | 3.90 | 4.10 |
| e | 1.27BSC | ||
| L | 0.50 | -- | 0.80 |
| a° | 0° | -- | 8° |
