Recently, at the 2023 Zhongguancun Forum 'Beijing (International) Third-Generation Semiconductor Innovation and Development Forum', Xiang Libin, member of the party group and deputy minister of the Ministry of Science and Technology, said that the third-generation semiconductors represented by silicon carbide and gallium nitride have excellent performance, there is a huge market in information communication, rail transit, smart grid, new能源車輛和其他田地。
新一代信息技術和工業化的深入整合正在加速,為綜合電路行業的發展創造了巨大的空間。例如,北京的舒尼區最初形成了從設備到材料,芯片,模塊,包裝和測試以及下游應用程序的工業鏈佈局。它在工業連鎖店中收集了20多個上游和下游企業,例如Tyco Tianrun,Guolian Wanzhong和Ruineng Semiconductor。在論壇上,六個工業項目在內,包括第二階段的SIC Power Chips of Guolian Wanzhong簽訂了合同,估計總投資將近18億元。
To this end, the third-generation semiconductor industry technology innovation strategic alliance jointly issued an initiative to focus on key market needs and promote the application of 'green core' and 'healthy core' based on third-generation semiconductor materials in the fields of new energy vehicles, photovoltaic energy storage, and new displays core'; focus on collaborative innovation of the industrial chain, jointly establish an創新聯盟,增強公共技術服務能力和標準化功能,並形成了協作創新狀況,在該情況下,連接了行業 - 大學研究的合作,上游和下游鏈緊密相連,大型和小型企業是共生的。