Package name: P600
P600 glass passivated chip junction
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min.
High Temperature soldering: 260°C/10 seconds at terminals.
Solder dip 275 °C max. 10 s, per JESD 22-B106

Package name: P600
P600 glass passivated chip junction
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min. 
High Temperature soldering: 260°C/10 seconds at terminals. 
Solder dip 275 °C max. 10 s, per JESD 22-B106

Package name: P600
P600 glass passivated chip junction
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min.
High Temperature soldering: 260°C/10 seconds at terminals.
Solder dip 275 °C max. 10 s, per JESD 22-B106

Package name: DO-201
P600 glass passivated chip junction
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min.
High Temperature soldering: 260°C/10 seconds at terminals. 
Solder dip 275 °C max. 10 s, per JESD 22-B106

Package name: DO-15
DO-15 glass passivated chip junction
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min
High Temperature soldering: 260°C/10 seconds at terminals.
Solder dip 275 °C max. 10 s, per JESD 22-B106

Package name: DO-15
Plastic package
Polarity: Color band denoted positive end (cathode) except Bidirectional.
Typical failure mode is short from over-specified voltage or current
Fast response time: typically less than 1.0ps from 0 Volts to BV min.
High Temperature soldering: 260°C/10 seconds at terminals
Solder dip 275 °C max. 10 s, per JESD 22-B106

5000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
SMD low profile surface mount package minimizing PCB footprin
Typical failure mode is short from over-specified voltage or current
Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
Fast response time: typically less than 1.0ps from 0V to BV min
Excellent clamping capability
Low incremental surge resistance

Package name: DO-214AB/SMC 
For surface mounted applications in order to optimize board space. 
Polarity: Color band denoted positive end (cathode) except Bidirectional. 
Typical failure mode is short from over-specified voltage or current.
High Temperature soldering:260°C/10 seconds at terminals. 
Terminal: Solder plated, solderable per MIL-STD-750,Method 2026.